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CompaniesApplicationsTechnology AreasAbout
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Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
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  • Submit Technology
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  • Terms of Use
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  • Technology Areas

About

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© 2026 Silicon Showcase™. All rights reserved.

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  1. Home
  2. /Technologies
  3. /FlexGen Multi-Die NoC IP

NEWLY INTRODUCED MULTI-DIE

Newly introduced multi-die NoC IP for non-coherent chiplet designs

BIDIRECTIONAL TRANSACTIONS OVER

Bidirectional transactions over a single UCIe PHY; up to 50% lower PHY area, power and I/O

APPLICATIONS

Automotive · AI & HPC · Data Center · +1

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

NEWLY INTRODUCED MULTI-DIE

Newly introduced multi-die NoC IP for non-coherent chiplet designs

BIDIRECTIONAL TRANSACTIONS OVER

Bidirectional transactions over a single UCIe PHY; up to 50% lower PHY area, power and I/O

APPLICATIONS

Automotive · AI & HPC · Data Center · +1

Public source

FlexGen Multi-Die NoC IP

Design & IP

FlexGen Multi-Die is the NoC IP Arteris announced on 15 September 2026 as an expansion of its multi-die portfolio, and publishes on its FlexGen Multi-Die product page.

  • Automotive
  • AI & HPC
  • +2
United StatesView Official Source (opens in a new tab)

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

Overview

Newly introduced Arteris FlexGen Multi-Die NoC IP extends non-coherent network-on-chip connectivity across die-to-die links. The expanded multi-die solution is available to early access partners and strategic customers.

The product adds die-to-die controller IP to Arteris FlexGen smart NoC IP so non-coherent connectivity can cross chiplet boundaries. Arteris’s announcement states that FlexGen Multi-Die supports bidirectional transactions over a single UCIe PHY, reducing PHY area, power and I/O requirements by up to 50%, and that it includes virtual-channel link technology and quality-of-service mechanisms for shared die-to-die links. It is positioned for non-coherent AI and HPC architectures and complements Ncore Multi-Die, which remains the cache-coherent product and is not this record. The product page also describes a configurable FLIT-format die-to-die controller for third-party PHYs including UCIe and BoW, up to eight independent receive and transmit virtual channels with credited links, and application domains spanning HPC and AI accelerators for data centers, automotive, consumer and industrial electronics. The expanded Arteris multi-die solution is available today to early access partners and strategic customers. This listing is distinct from FlexNoC already in the catalog.

Capabilities

Key characteristics associated with this technology.

  • Newly introduced multi-die NoC IP for non-coherent chiplet designs

  • Bidirectional transactions over a single UCIe PHY; up to 50% lower PHY area, power and I/O

  • Virtual channels and QoS across die-to-die links; FLIT-format D2D controller

  • Available to early access partners and strategic customers

Organization

Arteris

United States

View organization

Official resources

  • Arteris FlexGen Multi-Die product pagearteris.com (opens in a new tab)
  • Arteris multi-die announcement, 15 September 2026arteris.com (opens in a new tab)
  • Arteris IR release URL (CDN blocked in this environment)ir.arteris.com (opens in a new tab)

Source & disclosure

Independent discovery listing. This profile was prepared from publicly available information published by the organization. For the latest and complete technical information, refer to the official company source.

Official source

arteris.com (opens in a new tab)

Last source check

Oct 3, 2026

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