Discover IP, design tools, services and manufacturing partners across the SoC lifecycle.
264
Providers
36
Countries
264 providers
Germany1 solution
German semiconductor-equipment company that publishes thermal-management solutions for wafer test and advanced packaging. Official pages describe AirCool thermal chucks, debonding equipment, and a fully automated 310 × 310 mm panel-level packaging system manufactured at its Advanced Packaging facility in Barbing, Germany. Headquarters are listed in Germering, near Munich.
Packaging and chipletsView ProfileChina1 solution
Wireless SoC company that publishes Wi-Fi and Bluetooth microcontroller platforms, including ESP32.