Microchip Technology

United States·5 solutions

Semiconductor company that publishes embedded control, analog, connectivity and power offerings, including a silicon carbide (mSiC) technology portfolio.

Micron Technology

United States·1 solution

Semiconductor company focused on memory and storage technologies, including DRAM, NAND and publicly described high-bandwidth memory products.

Micronics Japan

Japan·1 solution

Probe-card company that publishes MEMS probe technologies, including MEMS-SP.

Microsoft

United States·1 solution

Custom-silicon company that publishes cloud AI accelerator architectures, including the Azure Maia series.

Mindgrove Technologies

India·1 solution

Fabless semiconductor company that publishes RISC-V-based system-on-chip platforms for IoT, embedded control and related connected-device applications.

Missing Link Electronics

United States·1 solution

Missing Link Electronics (MLE) provides FPGA IP cores for PCIe/NVMe connectivity and storage acceleration, with production license pricing published on the NVMe Streamer page.

Mixel

United States·1 solution

Mixel provides licensable mixed-signal connectivity IP, including MIPI D-PHY, C-PHY, and M-PHY physical-layer offerings plus LVDS and multi-standard SerDes, as described on its public product pages. The contact page lists the US office in Santa Clara, California.

Morphing Machines

India·1 solution

Company that publishes a many-core, runtime-reconfigurable processor architecture for mixed compute workloads on a shared silicon fabric.

MosChip Technologies Limited

India·1 solution

Public semiconductor company headquartered in Hyderabad. Turnkey ASIC is an engineering capability for taking a custom chip from design through fabrication, packaging, and validation.

Nanya Technology

Taiwan·1 solution

Independent DRAM company that publishes commodity and specialty DRAM, including 10nm-class process generations.

NAURA Technology Group

China·1 solution

Semiconductor equipment company that publishes wafer-fabrication tools, including plasma etch platforms.

Netrasemi

India·1 solution

Company that publishes edge AI system-on-chip platforms for on-device vision, analytics and related embedded intelligence.

Noesis Technologies

Greece·1 solution

Noesis Technologies licenses synthesizable FEC, compression, and security IP cores for ASIC and FPGA, including AES cipher family products.

Nordic Semiconductor

Norway·3 solutions

Wireless semiconductor company that publishes ultra-low-power IoT SoC platforms, including nRF54.

Nova

Israel·1 solution

Process-control company that publishes multidisciplinary optical and materials metrology platforms.

Nuclei System Technology

China·1 solution

Nuclei System Technology publishes a silicon-proven RISC-V processor IP portfolio spanning ultra-low-power 32-bit to high-performance 64-bit multicore Linux-class cores, with international and Shanghai contact details on its site.

NVIDIA

United States·1 solution

Computing technology company that publishes accelerated computing, processor, interconnect and AI platform technologies, including NVLink-C2C chip-to-chip interconnect.

NXP Semiconductors

Netherlands·1 solution

Semiconductor company that publishes automotive processing platforms for vehicle networking, zonal control and central compute, including the S32 family.

Onto Innovation

United States·1 solution

Process-control company that publishes inspection and metrology platforms for advanced packaging, including Dragonfly.

OPENEDGES Technology

South Korea·5 solutions

OPENEDGES develops memory subsystem and neural processing IP for SoC designs, including DDR memory controllers, DDR PHYs, on-chip interconnects, and neural processing units.

Photronics

United States·1 solution

Photomask company that publishes advanced IC photomasks used in semiconductor lithography.

Powerchip Semiconductor Manufacturing

Taiwan·1 solution

Foundry that publishes a 3D AI foundry ecosystem based on wafer-on-wafer stacking.