Discover 169 technologies from leading innovators around the world.
Apple Silicon is Apple’s fabless SoC platform. The M1 newsroom introduction defines a system-on-chip with CPU, GPU, Neural Engine, I/O and unified memory on a single package so those engines share one memory pool.
AI & HPCConsumer ElectronicsView Technology
Azure Maia 100 is Microsoft's first in-house cloud AI accelerator: 105 billion transistors on 5 nm, for Azure training and inference.
AI & HPCData CenterView Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData Center+1View Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData Center+1View Technology
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer Electronics+2View Technology
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
Consumer ElectronicsTelecommunications+1View Technology
Blackwell is NVIDIA’s current data-center GPU architecture, built as a dual-die GPU with a 10 TB/s chip-to-chip interconnect. Official materials describe a two-reticle design manufactured on TSMC 4NP.
AI & HPCData CenterView Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData Center+1View Technology
S32 is NXP’s automotive processing platform: common architecture across vehicle network processors, zonal and real-time controllers, radar and central compute. Official pages emphasize Arm Cortex-A/R/M mix, ASIL D safety, hardware security and TSN Ethernet.
AutomotiveIndustrialView Technology
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunications+1View Technology
Oryon is Qualcomm’s custom 64-bit CPU microarchitecture, including cache hierarchy, branch prediction, prefetch and later Flex Cache, designed in-house and scaled across Snapdragon platforms.
AutomotiveAI & HPC+2View Technology
SK hynix HBM4 doubles I/O to 2,048 terminals, claims >10 Gbps and more than 40% better power efficiency versus the prior generation, and uses Advanced MR-MUF to stack DRAM with warpage control and heat dissipation.
AI & HPCData CenterView Technology
Samsung’s 3 nm foundry node introduced Gate-All-Around transistors as Multi-Bridge-Channel FETs (MBCFET): stacked nanosheet channels with the gate on all four sides, replacing FinFET for better electrostatic control.
AutomotiveAI & HPC+2View Technology
Samsung HBM4 is the company’s current high-bandwidth DRAM stack for AI accelerators, with an advanced base die and stacked DRAM cubes. Samsung’s official HBM family page covers HBM3E through HBM4/HBM4E as the AI-memory roadmap.
AI & HPCData CenterView Technology
Samsung V10 BV-NAND is bonded vertical NAND with more than 400 word lines, brought to mass-production readiness for AI storage.
AI & HPCData Center+1View Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer Electronics+1View Technology
Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
AutomotiveIndustrialView Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrial+2View Technology
TPU7x (Ironwood) is Google Cloud's seventh-generation TPU, built for large-scale training and inference.
AI & HPCData CenterView Technology
Micron DDR DRAM is a synchronous DRAM component family spanning successive double-data-rate generations for data-center, industrial and automotive designs.
AutomotiveData Center+1View Technology
Micron 3D NAND is a vertically stacked NAND flash technology family used as the semiconductor storage building block in data-center, client, mobile and automotive designs.
AutomotiveAI & HPC+2View Technology
Micron LPDDR is a low-power DRAM family for mobile, client, automotive and data-center designs that need high bandwidth at reduced power. LPDDR generations remain one technology line.
AutomotiveAI & HPC+2View Technology
Micron GDDR is a discrete graphics DRAM family spanning GDDR6, GDDR6X and GDDR7 generations for GPUs, gaming systems and AI inference accelerators.
AI & HPCConsumer ElectronicsView Technology
