Sony SPAD dToF Depth Sensing

Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.

Official Sony Semiconductor Solutions technology and product pages describe a stacked construction with Cu-Cu connections between a back-illuminated SPAD pixel chip and a logic chip that holds timing circuits. A 10 June 2025 news release describes a stacked SPAD depth sensor for automotive LiDAR. This listing records the SPAD/dToF architecture rather than IMX459 or IMX479 as separate rows. Stacked CIS Cu-Cu is listed separately as the imaging platform that shares bonding methods but not this detector physics. Pixel size and ranging claims should be confirmed on Sony’s current ToF pages.