Discover 169 technologies from leading innovators around the world.
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView Technology
S32 is NXP’s automotive processing platform: common architecture across vehicle network processors, zonal and real-time controllers, radar and central compute. Official pages emphasize Arm Cortex-A/R/M mix, ASIL D safety, hardware security and TSN Ethernet.
AutomotiveIndustrialView Technology
ASM epitaxy is a crystalline film-growth equipment platform covering silicon and silicon-germanium transistor epitaxy and silicon carbide epitaxy. Distinct from ASM atomic layer deposition.
AutomotiveAI & HPCEnergyView Technology
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
AI & HPCConsumer ElectronicsView Technology
ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
AI & HPCConsumer ElectronicsView Technology
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
AI & HPCData CenterConsumer ElectronicsView Technology
ASML High-NA EUV lithography platform (TWINSCAN EXE) using 0.55 numerical aperture optics. Distinct from 0.33 NA TWINSCAN NXE EUV systems.
AI & HPCConsumer ElectronicsView Technology
