Discover 169 technologies from leading innovators around the world.
NB-IoT system-on-chip that WiSig Networks describes as a 3GPP-compliant device with satellite non-terrestrial-network support and edge AI.
TelecommunicationsIoTView Technology
Saankhya Labs' Pruthvi-3 is a software-defined radio chipset series spanning baseband, mobile-receiver and modulator devices.
TelecommunicationsIoTView Technology
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrial+2View Technology
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunications+1View Technology
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
Data CenterTelecommunications+1View Technology
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
AI & HPCData Center+1View Technology
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
AutomotiveTelecommunications+1View Technology
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
Data CenterConsumer Electronics+2View Technology
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Data CenterTelecommunications+1View Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunications+2View Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData Center+2View Technology
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
AutomotiveData Center+2View Technology
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
AutomotiveConsumer Electronics+2View Technology
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
AI & HPCData Center+1View Technology
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
AutomotiveAI & HPC+2View Technology
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
AutomotiveData Center+2View Technology
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer Electronics+2View Technology
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
AI & HPCConsumer Electronics+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData Center+1View Technology
Lattice Nexus is a low-power FPGA platform architecture, not a data-center compute accelerator architecture.
AutomotiveIndustrial+2View Technology
Analog Devices MxFE is a mixed-signal front-end platform that integrates high-speed converters and digital processing for RF sampling systems.
IndustrialTelecommunications+1View Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData Center+2View Technology
Tower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.
AutomotiveData Center+2View Technology
Soitec Smart Cut is the engineered-substrate process used to transfer a thin crystalline silicon film onto an insulator, producing SOI wafers.
AutomotiveIndustrial+2View Technology
