Discover 169 technologies from leading innovators around the world.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
Signalchip Agumbe is a wireless semiconductor chipset family covering LTE baseband and RF transceiver devices for cellular communications equipment.
Morphing Machines REDEFINE is a many-core processor architecture that instantiates domain-specific compute structures on a shared fabric at runtime.
FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.
AGNIT publishes gallium nitride semiconductor technology spanning epitaxial wafers and RF devices for high-frequency and high-power electronic systems in telecommunications and related strategic applications.
proteanTecs combines embedded on-chip monitoring agents and sensors with integration tools and analytics software to provide visibility into silicon performance, reliability and behavior across production and in-field operation.
Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
imec silicon photonics platform family (iSiPP) for photonic integrated circuits. iSiPP200, iSiPP300 and related flavors are variants of this family, not separate listings.
Intel silicon photonics platform combining photonic integrated circuits and on-chip lasers for optical connectivity products. Optical compute interconnect remains part of this platform, not a separate listing.
