Discover 169 technologies from leading innovators around the world.
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
AI & HPCData CenterIndustrialView Technology
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AutomotiveAI & HPCData CenterView Technology
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
Data CenterTelecommunicationsAerospace & DefenseView Technology
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
AutomotiveAI & HPCData CenterView Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData CenterConsumer ElectronicsView Technology
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Data CenterTelecommunicationsAerospace & DefenseView Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData CenterTelecommunications+1View Technology
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
AutomotiveAI & HPCData CenterView Technology
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AutomotiveAI & HPCData CenterView Technology
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
AutomotiveData CenterIndustrial+1View Technology
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
AutomotiveAI & HPCData Center+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData CenterTelecommunicationsView Technology
onsemi EliteSiC is the company’s silicon-carbide power-device platform for traction, industrial and energy conversion.
AutomotiveData CenterIndustrial+1View Technology
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
AI & HPCData CenterView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1
Cerebras Wafer-Scale Engine 3 is a wafer-scale AI processor: one chip occupying an entire 300mm wafer for large-model training and inference.
AI & HPCData CenterView Technology
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterConsumer ElectronicsView Technology
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterConsumer ElectronicsView Technology
Trainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.
AI & HPCData CenterView Technology
Azure Maia 100 is Microsoft's first in-house cloud AI accelerator: 105 billion transistors on 5 nm, for Azure training and inference.
AI & HPCData CenterView Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterTelecommunicationsView Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData CenterTelecommunicationsView Technology
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
Blackwell is NVIDIA’s current data-center GPU architecture, built as a dual-die GPU with a 10 TB/s chip-to-chip interconnect. Official materials describe a two-reticle design manufactured on TSMC 4NP.
AI & HPCData CenterView Technology
