Discover 169 technologies from leading innovators around the world.
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
AutomotiveAI & HPCData CenterView Technology
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
AutomotiveAI & HPCIndustrial+1View Technology
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
AI & HPCData CenterTelecommunicationsView Technology
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AutomotiveAI & HPCData CenterView Technology
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
AutomotiveAI & HPCData Center+1
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
AutomotiveAI & HPCConsumer Electronics+1View Technology
Technoprobe TPEG Vertical MEMS is a named probe-card technology for wafer test, not a finished tester or a MEMS sensor product.
AutomotiveAI & HPCData CenterView Technology
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
Lasertec ACTIS is an actinic EUV photomask inspection platform for high-volume EUV mask qualification.
AI & HPCData CenterConsumer ElectronicsView Technology
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
AutomotiveAI & HPCData Center+1View Technology
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
AutomotiveAI & HPCData Center+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData CenterTelecommunicationsView Technology
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView Technology
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
AI & HPCData CenterView Technology
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
AI & HPCData CenterView Technology
CXMT LPDDR6 is ChangXin Memory Technologies’ current low-power DRAM generation, described in official newsroom coverage of mass production for mobile and AI-adjacent platforms.
AI & HPCData CenterConsumer ElectronicsView Technology
Cambricon MLUarch03 is the company’s published AI processor architecture for machine-learning accelerators.
AI & HPCData CenterView Technology
NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
AutomotiveAI & HPCIndustrial+1View Technology
AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.
AI & HPCData CenterConsumer ElectronicsView Technology
Renesas R-Car is an automotive system-on-chip platform for ADAS, cockpit and vehicle compute, not a standalone data-center accelerator architecture.
AutomotiveAI & HPCView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
AutomotiveAI & HPCData Center+1View Technology
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData CenterConsumer Electronics+1View Technology
