Discover 169 technologies from leading innovators around the world.
Ultra-low-power connected-device system-on-chip that Sensesemi describes with wireless connectivity, a microcontroller, and an edge AI accelerator.
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
ESP32 is Espressif’s Wi-Fi and Bluetooth SoC platform, not a module SKU catalog and not processor IP.
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
Valens Stello VS3000 is high-speed connectivity silicon for AVoIP, not processor IP and not a finished camera.
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
