Discover 169 technologies from leading innovators around the world.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPCConsumer ElectronicsView Technology
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
AI & HPCData CenterIndustrialView Technology
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
AI & HPCIndustrialAerospace & Defense+1View Technology
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
AI & HPCConsumer ElectronicsIoTView Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPCIndustrial+1View Technology
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
AutomotiveAI & HPCEnergyView Technology
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AutomotiveAI & HPCData CenterView Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer ElectronicsMedical+1View Technology
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
AutomotiveAI & HPCData CenterView Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData CenterConsumer ElectronicsView Technology
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
AutomotiveAI & HPCData CenterView Technology
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AutomotiveAI & HPCData CenterView Technology
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
AutomotiveAI & HPCData Center+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData CenterTelecommunicationsView Technology
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
AI & HPCData CenterView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1
Cerebras Wafer-Scale Engine 3 is a wafer-scale AI processor: one chip occupying an entire 300mm wafer for large-model training and inference.
AI & HPCData CenterView Technology
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterConsumer ElectronicsView Technology
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterConsumer ElectronicsView Technology
Trainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.
AI & HPCData CenterView Technology
Apple Silicon is Apple’s fabless SoC platform. The M1 newsroom introduction defines a system-on-chip with CPU, GPU, Neural Engine, I/O and unified memory on a single package so those engines share one memory pool.
AI & HPCConsumer ElectronicsView Technology
Azure Maia 100 is Microsoft's first in-house cloud AI accelerator: 105 billion transistors on 5 nm, for Azure training and inference.
AI & HPCData CenterView Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterTelecommunicationsView Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData CenterTelecommunicationsView Technology
