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Public source

Floadia LEE Flash G1 Embedded Flash IP

The LEE Flash G1 page reviewed on 12 November 2026 describes G1 as based on simple SONOS architecture, scalable to 40 nm geometry, supporting automotive-grade temperature/quality, and suited to medium capacities up to several 100 KBytes, without changing standard CMOS logic transistor characteristics/SPICE models.

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Overview

Sample spec table lists 180 BCD platform, 256 KByte memory, 64+8 word size, 100k P/E cycles, VDD 1.62–1.98 V / VCC 3.0–5.5 V, 2 additional masks, Tj −40–150°C, and 10-year retention at 125°C post 10K cycles at 125°C. Features emphasize high-temperature retention, low-power FN-tunneling program/erase, 2–3 mask adder, reuse of existing CMOS IP, and short test/bake time. Availability table includes TSMC 180 BCD 256KB AEC-Q100 Grade 1; multiple SMIC 90 BCDE/BCDA densities; GTA 90 BCD; SK Hynix 110 BCD 512KB; and PSMC 90 mixed-signal consumer densities. Home page frames a Nonvolatile Memory IP business providing easily embedded NVM IP and notes G1 on TSMC automotive platform AEC-Q100 Grade 1. Official product page confirms licensable automotive eFlash NVM IP with foundry/density table.

Technical capabilities

  • Published as design IP

    Licensable semiconductor IP. This listing is not a finished controller chip.

  • Finder function

    Embedded Flash (SONOS eFlash)

  • Numbered specification: LEE Flash G1

    LEE Flash G1 is named for this product on the reviewed page.

  • Numbered specification: densities 32–512 KByte across listed foundry rows

    densities 32–512 KByte across listed foundry rows is named for this product on the reviewed page.

  • Numbered specification: AEC-Q100 Grade 1 automotive rows

    AEC-Q100 Grade 1 automotive rows is named for this product on the reviewed page.

Lifecycle and categories

Lifecycle stages
Memory and subsystem IP
Solution categories
Embedded Memory IP
Supported versions
LEE Flash G1; densities 32–512 KByte across listed foundry rows; AEC-Q100 Grade 1 automotive rows
Compatibility
BCD/CMOS foundry rows named (TSMC, SMIC, GTA, SK Hynix, PSMC); logic SPICE reuse claimed. Source

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