
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Batch ALD is a publicly named Kokusai Electric deposition technology.
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
Official Kokusai business pages describe batch ALD as combining ALD step coverage with batch productivity for deeper, narrower 3D structures. This listing records Batch ALD rather than every Kokusai furnace SKU.
Furnace ALD rather than a single-wafer ALD SKU catalog
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solutionSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionEpitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
View solution