
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
NVIDIA NVLink-C2C is a publicly named high-bandwidth coherent chip-to-chip interconnect for connecting processors, accelerators and custom silicon.
Official NVIDIA pages describe NVLink-C2C as an interconnect used in chiplet and advanced multi-die systems, including integration in advanced packages. NVIDIA NVLink, listed separately, is the system-level GPU interconnect used within servers and across racks with NVLink Switch. Signaling rates, protocol details and product-generation mappings should be confirmed on NVIDIA's current NVLink-C2C documentation.
Distinct from NVLink GPU-to-GPU scale-up fabric, which is listed separately
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
View solutionLicensable Arm Neoverse CMN S3 coherent interconnect IP. The page documents AMBA 5 CHI and multichip support. A UCIe PHY is not included.
View solutionNon-coherent network-on-chip IP for cost-efficient, low-power IoT and microcontroller SoCs.
View solutionLicensable cache-coherent NoC IP. The page documents AMBA CHI and ACE. A Multi-Die option requires a separate die-to-die controller and PHY. A UCIe PHY is not included.
View solutionAyar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
View solutionBaya Systems WeaveIP is chiplet-ready Network-on-Chip fabric IP for SoC and multi-chiplet systems. The official site describes a protocol-agnostic unified transport for coherent, non-coherent, and switch-fabric traffic paired with WeaverPro modeling software.
View solution