Discover 169 technologies from leading innovators around the world.
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
TrenchFET Gen V Power MOSFETs are Vishay's current published trench power-MOSFET generation.
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
Allegro XtremeSense TMR is a tunneling-magnetoresistance magnetic-sensing platform, not a Hall-only catalog.
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
Technoprobe TPEG Vertical MEMS is a named probe-card technology for wafer test, not a finished tester or a MEMS sensor product.
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
Lasertec ACTIS is an actinic EUV photomask inspection platform for high-volume EUV mask qualification.
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
Texas Instruments analog BCD (LBC) is TI’s bipolar-CMOS-DMOS process identity for foundational analog and power silicon, described in official TI manufacturing communications.
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
