Discover 169 technologies from leading innovators around the world.
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
AutomotiveIndustrialConsumer Electronics+1View Technology
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
AutomotiveAI & HPCIndustrialView Technology
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
AI & HPCData CenterTelecommunicationsView Technology
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
AutomotiveAI & HPCData CenterView Technology
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveIndustrialConsumer ElectronicsView Technology
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
AutomotiveIndustrialConsumer Electronics+1View Technology
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
AI & HPCData CenterConsumer ElectronicsView Technology
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
AutomotiveAI & HPCData CenterView Technology
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
AutomotiveIndustrialConsumer ElectronicsView Technology
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
AutomotiveAI & HPCData CenterView Technology
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
AutomotiveData CenterIndustrial+1View Technology
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
AutomotiveTelecommunicationsAerospace & DefenseView Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData CenterConsumer ElectronicsView Technology
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
Data CenterConsumer ElectronicsTelecommunications+1
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
AutomotiveIndustrialConsumer Electronics+1View Technology
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrialConsumer ElectronicsView Technology
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
AutomotiveAI & HPCIndustrial+1View Technology
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveConsumer ElectronicsView Technology
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Data CenterTelecommunicationsAerospace & DefenseView Technology
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
AutomotiveData CenterIndustrial+1View Technology
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
AutomotiveAI & HPCData CenterView Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunicationsEnergy+1View Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData CenterTelecommunications+1View Technology
Nova’s multidisciplinary metrology platform combines optical scatterometry, X-ray and materials analysis for process control.
AutomotiveAI & HPCData CenterView Technology
