Discover 169 technologies from leading innovators around the world.
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView Technology
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
AI & HPCData CenterView Technology
onsemi EliteSiC is the company’s silicon-carbide power-device platform for traction, industrial and energy conversion.
AutomotiveData CenterIndustrial+1View Technology
Hua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.
AutomotiveIndustrialConsumer Electronics+1
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
AI & HPCData CenterView Technology
CXMT LPDDR6 is ChangXin Memory Technologies’ current low-power DRAM generation, described in official newsroom coverage of mass production for mobile and AI-adjacent platforms.
AI & HPCData CenterConsumer ElectronicsView Technology
Lattice Nexus is a low-power FPGA platform architecture, not a data-center compute accelerator architecture.
AutomotiveIndustrialConsumer Electronics+1View Technology
Cambricon MLUarch03 is the company’s published AI processor architecture for machine-learning accelerators.
AI & HPCData CenterView Technology
Analog Devices MxFE is a mixed-signal front-end platform that integrates high-speed converters and digital processing for RF sampling systems.
IndustrialTelecommunicationsAerospace & DefenseView Technology
NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
AutomotiveAI & HPCIndustrial+1View Technology
AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.
AI & HPCData CenterConsumer ElectronicsView Technology
Renesas R-Car is an automotive system-on-chip platform for ADAS, cockpit and vehicle compute, not a standalone data-center accelerator architecture.
AutomotiveAI & HPCView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Nanya’s second-generation 10nm-class DRAM is the company’s current DRAM process generation, described in official investor communications.
AutomotiveData CenterConsumer ElectronicsView Technology
Tower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.
AutomotiveData CenterTelecommunications+1View Technology
Soitec Smart Cut is the engineered-substrate process used to transfer a thin crystalline silicon film onto an insulator, producing SOI wafers.
AutomotiveIndustrialConsumer Electronics+1View Technology
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
AutomotiveAI & HPCData Center+1View Technology
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Cerebras Wafer-Scale Engine 3 is a wafer-scale AI processor: one chip occupying an entire 300mm wafer for large-model training and inference.
AI & HPCData CenterView Technology
Nordic nRF54 is an ultra-low-power wireless IoT SoC platform, represented by the official nRF54H20 product family.
IndustrialConsumer ElectronicsMedical+1View Technology
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterConsumer ElectronicsView Technology
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterConsumer ElectronicsView Technology
Trainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.
AI & HPCData CenterView Technology
