Discover 169 technologies from leading innovators around the world.
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
AutomotiveData CenterIndustrial+1View Technology
Entegris Advanced Deposition Materials is a process-materials platform for precursor and deposition chemistries used in semiconductor manufacturing.
AutomotiveAI & HPCData Center+1View Technology
Texas Instruments analog BCD (LBC) is TI’s bipolar-CMOS-DMOS process identity for foundational analog and power silicon, described in official TI manufacturing communications.
AutomotiveIndustrialConsumer Electronics+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData CenterTelecommunicationsView Technology
onsemi EliteSiC is the company’s silicon-carbide power-device platform for traction, industrial and energy conversion.
AutomotiveData CenterIndustrial+1View Technology
Astera Labs Intelligent Connectivity Platform is PCIe, CXL and Ethernet connectivity silicon for AI and data-center racks, not a compute accelerator architecture.
AI & HPCData CenterView Technology
Lattice Nexus is a low-power FPGA platform architecture, not a data-center compute accelerator architecture.
AutomotiveIndustrialConsumer Electronics+1View Technology
Analog Devices MxFE is a mixed-signal front-end platform that integrates high-speed converters and digital processing for RF sampling systems.
IndustrialTelecommunicationsAerospace & DefenseView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1
Cerebras Wafer-Scale Engine 3 is a wafer-scale AI processor: one chip occupying an entire 300mm wafer for large-model training and inference.
AI & HPCData CenterView Technology
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData CenterConsumer ElectronicsView Technology
Infinity Fabric is AMD’s coherent on-package and multi-die interconnect, linking CPU core-complex dies to a central I/O die and, in multi-socket systems, across packages. Official EPYC architecture documents describe CCD–IOD GMI links and xGMI.
AI & HPCData CenterConsumer ElectronicsView Technology
Trainium is AWS’s custom machine-learning training silicon, built around NeuronCore and used in EC2 Trn instances. Official AWS silicon pages describe purpose-built ML chips as part of AWS custom silicon.
AI & HPCData CenterView Technology
Apple Silicon is Apple’s fabless SoC platform. The M1 newsroom introduction defines a system-on-chip with CPU, GPU, Neural Engine, I/O and unified memory on a single package so those engines share one memory pool.
AI & HPCConsumer ElectronicsView Technology
Azure Maia 100 is Microsoft's first in-house cloud AI accelerator: 105 billion transistors on 5 nm, for Azure training and inference.
AI & HPCData CenterView Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterTelecommunicationsView Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData CenterTelecommunicationsView Technology
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer ElectronicsTelecommunications+1
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
Blackwell is NVIDIA’s current data-center GPU architecture, built as a dual-die GPU with a 10 TB/s chip-to-chip interconnect. Official materials describe a two-reticle design manufactured on TSMC 4NP.
AI & HPCData CenterView Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData CenterTelecommunicationsView Technology
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunicationsIoTView Technology
Oryon is Qualcomm’s custom 64-bit CPU microarchitecture, including cache hierarchy, branch prediction, prefetch and later Flex Cache, designed in-house and scaled across Snapdragon platforms.
AutomotiveAI & HPCData Center+1View Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer ElectronicsTelecommunicationsView Technology
