Discover 169 technologies from leading innovators around the world.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData Center+2View Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData Center+1View Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData Center+1View Technology
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer Electronics+2View Technology
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
Consumer ElectronicsTelecommunications+1View Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData Center+1View Technology
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunications+1View Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer Electronics+1View Technology
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
IndustrialMedical+2View Technology
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer Electronics+1View Technology
Signalchip Agumbe is a wireless semiconductor chipset family covering LTE baseband and RF transceiver devices for cellular communications equipment.
TelecommunicationsIoTView Technology
Morphing Machines REDEFINE is a many-core processor architecture that instantiates domain-specific compute structures on a shared fabric at runtime.
AutomotiveAI & HPC+1View Technology
FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.
AI & HPCData Center+1View Technology
AGNIT publishes gallium nitride semiconductor technology spanning epitaxial wafers and RF devices for high-frequency and high-power electronic systems in telecommunications and related strategic applications.
AutomotiveTelecommunications+1View Technology
proteanTecs combines embedded on-chip monitoring agents and sensors with integration tools and analytics software to provide visibility into silicon performance, reliability and behavior across production and in-field operation.
AutomotiveAI & HPC+2View Technology
Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
AI & HPCData Center+1View Technology
imec silicon photonics platform family (iSiPP) for photonic integrated circuits. iSiPP200, iSiPP300 and related flavors are variants of this family, not separate listings.
Data CenterTelecommunicationsView Technology
Intel silicon photonics platform combining photonic integrated circuits and on-chip lasers for optical connectivity products. Optical compute interconnect remains part of this platform, not a separate listing.
Data CenterTelecommunicationsView Technology
