Discover 169 technologies from leading innovators around the world.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterTelecommunicationsView Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData CenterTelecommunications
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer ElectronicsTelecommunications+1
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
Consumer ElectronicsTelecommunicationsIoTView Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData CenterTelecommunications
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunicationsIoTView Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer ElectronicsTelecommunicationsView Technology
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
IndustrialMedicalTelecommunications+1
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
Signalchip Agumbe is a wireless semiconductor chipset family covering LTE baseband and RF transceiver devices for cellular communications equipment.
TelecommunicationsIoTView Technology
Morphing Machines REDEFINE is a many-core processor architecture that instantiates domain-specific compute structures on a shared fabric at runtime.
AutomotiveAI & HPCTelecommunicationsView Technology
FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.
AI & HPCData CenterTelecommunicationsView Technology
AGNIT publishes gallium nitride semiconductor technology spanning epitaxial wafers and RF devices for high-frequency and high-power electronic systems in telecommunications and related strategic applications.
AutomotiveTelecommunicationsAerospace & DefenseView Technology
proteanTecs combines embedded on-chip monitoring agents and sensors with integration tools and analytics software to provide visibility into silicon performance, reliability and behavior across production and in-field operation.
AutomotiveAI & HPCData Center+1
Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
AI & HPCData CenterTelecommunicationsView Technology
Intel silicon photonics platform combining photonic integrated circuits and on-chip lasers for optical connectivity products. Optical compute interconnect remains part of this platform, not a separate listing.
Data CenterTelecommunicationsView Technology
