Discover 169 technologies from leading innovators around the world.
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView Technology
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
AI & HPCConsumer ElectronicsView Technology
ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
AI & HPCConsumer ElectronicsView Technology
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
AI & HPCData CenterConsumer ElectronicsView Technology
ASML High-NA EUV lithography platform (TWINSCAN EXE) using 0.55 numerical aperture optics. Distinct from 0.33 NA TWINSCAN NXE EUV systems.
AI & HPCConsumer ElectronicsView Technology
