Discover 169 technologies from leading innovators around the world.
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
AutomotiveAI & HPCIndustrialView Technology
ASMPT LITHOBOLT G2 is a die-to-wafer hybrid-bonding system for direct and collective bonding.
AutomotiveAI & HPCData CenterView Technology
Aixtron Planetary Reactor is a batch MOCVD reactor architecture for compound-semiconductor epitaxy.
AutomotiveData CenterTelecommunications+1View Technology
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
AutomotiveAI & HPCConsumer ElectronicsView Technology
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
AutomotiveAI & HPCData CenterView Technology
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
AutomotiveAI & HPCIndustrial+1View Technology
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
AutomotiveAI & HPCData Center+1View Technology
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
AutomotiveAI & HPCConsumer ElectronicsView Technology
NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
AutomotiveAI & HPCIndustrial+1View Technology
ASM epitaxy is a crystalline film-growth equipment platform covering silicon and silicon-germanium transistor epitaxy and silicon carbide epitaxy. Distinct from ASM atomic layer deposition.
AutomotiveAI & HPCEnergyView Technology
