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13 results for MEMS & Sensors

GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrialConsumer ElectronicsView Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData CenterTelecommunications+1View Technology
SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
AutomotiveIndustrialConsumer Electronics+1View Technology
Allegro XtremeSense TMR is a tunneling-magnetoresistance magnetic-sensing platform, not a Hall-only catalog.
AutomotiveIndustrialEnergyView Technology
Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
AutomotiveIndustrialView Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrialConsumer Electronics+1View Technology
Bosch MEMS sensor technology uses microelectromechanical structures to translate physical changes such as motion, pressure and environmental conditions into electrical information for compact sensing applications.
IndustrialConsumer ElectronicsIoTView TechnologyGermany1 technology
Semiconductor sensing company that publishes microelectromechanical (MEMS) sensor technology for consumer electronics, IoT and related compact sensing applications.