AONDevices

United States·1 solution

AONDevices provides edge-AI IP cores and chips for always-on voice and sound recognition in battery-powered devices. The official site lists an Irvine, California address.

Applied Materials

United States·2 solutions

Materials engineering and wafer-fab equipment company that publishes semiconductor process platforms used to deposit, shape, modify and analyze materials on wafers.

Aragio Solutions

United States·1 solution

Aragio Solutions specializes in ESD-tolerant I/O library IP for package interconnect across foundry nodes, as described on its homepage.

Arasan Chip Systems

United States·4 solutions

Arasan Chip Systems provides licensable semiconductor interface IP for mobile storage and connectivity, including MIPI, UFS, SD, SDIO, eMMC, and related PHY and controller offerings described on its public product pages.

Arm

United Kingdom·6 solutions

Semiconductor IP and architecture company that publishes processor, system and chiplet-related architecture specifications used in SoC and multi-die design.

Arteris

United States·6 solutions

Semiconductor IP company that publishes on-chip interconnect IP, including FlexNoC.

ASE Technology Holding

Taiwan·1 solution

Outsourced semiconductor assembly and test company that publishes advanced packaging platforms, including VIPack.

ASM

Netherlands·2 solutions

Wafer fabrication equipment company (ASM International) that publishes atomic layer deposition and related process-equipment technology for semiconductor manufacturing.

ASML

Netherlands·3 solutions

Lithography equipment company based in Veldhoven, the Netherlands, that publishes EUV and High-NA EUV system information used in advanced chip manufacturing.

ASMPT

Hong Kong·1 solution

Assembly-equipment company that publishes hybrid-bonding tools, including LITHOBOLT.

Astera Labs

United States·1 solution

Connectivity-silicon company that publishes PCIe, CXL and Ethernet retimer and switch platforms for AI racks.

AT&S

Austria·1 solution

IC-substrate company that publishes high-density build-up substrates used to connect advanced processors to system boards.

Atomic Rules LLC

United States·1 solution

Atomic Rules LLC provides FPGA networking IP cores including UDP offload engines. The UOE page lists an Auburn, NH address.

Atria Logic

United States·1 solution

Atria Logic provides multimedia, memory-controller, and bus-interface IP cores for FPGA/ASIC, including H.264 codec IP and PCIe/USB/Ethernet controllers.

Attopsemi Technology

Taiwan·1 solution

Attopsemi Technology provides I-fuse OTP IP and related circuit design services for foundry-independent one-time programmable memory macros.

Aura Semiconductor Co., Ltd.

India·1 solution

Fabless semiconductor company founded in Bangalore, India in 2011. Aura Semiconductor designs mixed-signal ICs spanning timing, power management, RF signal-chain components and sensors, with principal offices listed in Bangalore, Shenzhen, Shanghai and Milpitas.

AXT

United States·1 solution

Compound-semiconductor materials company that publishes VGF substrates for III-V devices.

Ayar Labs

United States·1 solution

Company that publishes optical I/O chiplet technology combining silicon photonics with CMOS for in-package and package-to-package connectivity.

Baya Systems

United States·1 solution

Baya Systems provides chiplet-ready Network-on-Chip fabric IP (WeaveIP) and architecture software (WeaverPro) for AI and SoC data-movement designs, with Santa Clara, CA address listed.

BE Semiconductor Industries

Netherlands·1 solution

Assembly-equipment company that publishes die-attach and hybrid-bonding tools, including Datacon 8800 CHAMEO.

Beyond Semiconductor

Slovenia·1 solution

Beyond Semiconductor provides the BA2x 32-bit processor IP family and related peripherals, with license request options on its site.

BitSim

Sweden·1 solution

BitSim is an electronics design house focused on embedded imaging and edge computing, offering reusable FPGA IP blocks for video, graphics, and data acquisition.