Discover companies, startups, universities and research organizations with published technology listings.
137
Organizations
18
Countries
12
Technology Areas
137 organizations
Switzerland·1 technology
Secure-element semiconductor company that publishes VaultIC chips for identity and IoT security.
Analog company that publishes analog and mixed-signal IC platforms.
South Korea·1 technology
Memory semiconductor company that publishes high-bandwidth DRAM technologies, including HBM4 stacked with Advanced MR-MUF.
China·1 technology
Pure-play foundry that publishes logic process technologies, including 28nm high-k metal-gate (HKMG).
Switzerland·2 technologies
Semiconductor company that publishes power-transistor families, including STPOWER silicon carbide MOSFET technology for high-voltage power-conversion designs.
Japan·1 technology
Silicon-wafer company that publishes advanced semiconductor wafer platforms.
India·1 technology
Saankhya Labs is part of Tejas Networks. Its former website redirects to tejasnetworks.com. Tejas press releases describe Saankhya as a subsidiary and name its software-defined radio chipsets, including the Pruthvi-3 SDR Chipset Series.
South Korea·3 technologies
Semiconductor company that publishes memory, foundry process and image-sensor technologies, including HBM, V10 BV-NAND and GAA MBCFET process platforms.
Compound-semiconductor company that publishes LED epitaxy and chip platforms.
United States·1 technology
Connectivity company that publishes the LoRa long-range IoT radio platform.
Bengaluru fabless semiconductor company developing system-on-chip platforms for connected devices. Its published flagship platform is SenseSoC.
Timing company that publishes MEMS resonator processes, including MEMS First and EpiSeal.
Fabless semiconductor company that publishes wireless modem and RF transceiver chipset technology for cellular base-station and related communications equipment.
Power-IC company that publishes integrated PMIC platforms.
Wireless-SoC company that publishes the Series 3 wireless platform.
US foundry that publishes specialty CMOS process platforms, including radiation-hardened RH90.
RF company that publishes 5G front-end system solutions, including Sky5.
CMOS-imaging company that publishes SmartClarity image-sensor platforms.
France·1 technology
Engineered-substrate company that publishes SOI wafer technology based on the Smart Cut process.
Japan·2 technologies
Semiconductor company that publishes CMOS image-sensor and depth-sensing technologies, including stacked CIS with Cu-Cu connection and SPAD dToF sensors.
United States·2 technologies
Electronic design automation and semiconductor IP company that publishes die-to-die interface IP, including UCIe controller, PHY and verification IP.
Taiwan·4 technologies
Dedicated semiconductor foundry headquartered in Hsinchu, Taiwan, offering wafer manufacturing plus publicly described 3D stacking and advanced packaging services.
Italy·1 technology
Probe-card company that publishes wafer-test interface technologies, including TPEG Vertical MEMS.
Photomask company, formerly Toppan Photomask, that publishes semiconductor photomask products for IC manufacturing.
