Discover companies, startups, universities and research organizations with published technology listings.
137
Organizations
18
Countries
12
Technology Areas
137 organizations
China·1 technology
Memory company that publishes SPI NOR flash families, including GD25 and GD55.
ASIC company that publishes 2.5D/3D multi-die advanced-packaging design platforms.
United States·1 technology
Foundry company that publishes FD-SOI process platforms, including 22FDX for low-power, RF, automotive and IoT designs.
Taiwan·1 technology
Silicon-wafer company that publishes annealed, epitaxial, SOI and diffusion wafers.
Custom-silicon company that publishes cloud AI accelerator architectures, including the Tensor Processing Unit family.
South Korea·1 technology
Back-end equipment company that publishes HBM thermocompression bonders, including Dual TC Bonder tools.
Specialty foundry that publishes embedded-memory process platforms for automotive, industrial and consumer silicon.
CMP-equipment company that publishes 300 mm polishing platforms, including Universal-H300.
India·1 technology
Fabless semiconductor company that publishes configurable RISC-V processor IP and related SoC-generation tools for custom silicon design.
Germany·4 technologies
Semiconductor company that publishes wide-bandgap power device families, including silicon carbide CoolSiC and gallium nitride CoolGaN product lines.
United States·3 technologies
Public semiconductor company that designs processors and related platforms and publishes foundry packaging, assembly and silicon photonics information for industry use.
United States·2 technologies
Process-control company that publishes wafer inspection, review and metrology systems used to find and classify defects during chip manufacturing.
Japan·1 technology
Deposition-equipment company that publishes batch ALD platforms.
Singapore·1 technology
Semiconductor assembly-equipment company that publishes thermo-compression bonders, including APTURA.
Wafer fabrication equipment supplier that publishes etch, deposition, clean and related process-equipment information for semiconductor manufacturing.
Inspection-equipment company that publishes actinic EUV mask inspection systems, including ACTIS.
FPGA company that publishes low-power programmable platforms, including Lattice Nexus.
Company that publishes photonic interconnect platform technology intended to scale high-bandwidth communication in advanced computing systems.
Compound-semiconductor company that publishes III-V foundry process platforms at its European Semiconductor Center.
Ceramics company that publishes silicon-nitride substrate families for power modules and other high-temperature electronics.
Semiconductor company that publishes coherent optical DSP silicon for long-haul, metro and data-center interconnect.
Semiconductor company that publishes Wi-Fi connectivity silicon platforms, including Filogic Wi-Fi 6/6E/7 solutions for access points and devices.
Semiconductor company that publishes embedded control, analog, connectivity and power offerings, including a silicon carbide (mSiC) technology portfolio.
United States·5 technologies
Semiconductor company focused on memory and storage technologies, including DRAM, NAND and publicly described high-bandwidth memory products.
