Companies & Organizations

Ayar Labs

United States·1 technology

Company that publishes optical I/O chiplet technology combining silicon photonics with CMOS for in-package and package-to-package connectivity.

BE Semiconductor Industries

Netherlands·1 technology

Assembly-equipment company that publishes die-attach and hybrid-bonding tools, including Datacon 8800 CHAMEO.

Bosch Sensortec

Germany·1 technology

Semiconductor sensing company that publishes microelectromechanical (MEMS) sensor technology for consumer electronics, IoT and related compact sensing applications.

Broadcom

United States·2 technologies

Semiconductor company that publishes Ethernet switch silicon and co-packaged optics platforms, including Tomahawk switch ASICs.

CEVA

United States·1 technology

Processor-IP company that publishes DSP and neural-processing IP, including CEVA-NeuPro-Nano.

Cadence Design Systems

United States·1 technology

Electronic design automation company that publishes multi-die design software, including the Integrity 3D-IC platform for planning, implementation and analysis of stacked-die systems.

Cambricon Technologies

China·1 technology

AI processor company that publishes accelerator architectures, including MLUarch03.

Camtek

Israel·1 technology

Inspection-equipment company that publishes Eagle inspection and metrology platforms.

Cerebras Systems

United States·1 technology

AI systems company that publishes wafer-scale processors, including Wafer-Scale Engine 3.

ChangXin Memory Technologies

China·1 technology

Memory semiconductor company that publishes DRAM products, including LPDDR6 for mobile and AI-adjacent platforms.

Cirrus Logic

United States·1 technology

Mixed-signal company that publishes Halo Core haptic-driver platforms.

Coherent

United States·1 technology

Materials and compound-semiconductor company that publishes III-V epitaxial wafer platforms for photonic and RF devices.

Cohu

United States·1 technology

Semiconductor test-equipment company that publishes ATE instrumentation, including Diamondx.

Credo Technology

United States·1 technology

High-speed connectivity silicon company that publishes SerDes IP and DSP platforms for data-center and AI interconnect.

DISCO Corporation

Japan·1 technology

Precision processing equipment company that publishes dicing and grinding processes, including DBG with DAF laser cut.

Elmos Semiconductor

Germany·1 technology

Automotive mixed-signal semiconductor company that publishes motor-control ICs, including brushless DC motor drivers.

Entegris

United States·1 technology

Process-materials company that publishes advanced deposition materials and contamination-control products for semiconductor manufacturing.

Espressif Systems

China·1 technology

Wireless SoC company that publishes Wi-Fi and Bluetooth microcontroller platforms, including ESP32.

FermionIC Design

India·1 technology

Fabless semiconductor company that publishes high-speed SERDES IP and RF mixed-signal chipsets for connectivity, radar, satellite communications and 5G phased-array systems.

FormFactor

United States·1 technology

Probe-card company that publishes composite-metal MEMS probe technology.

GCT Semiconductor

United States·1 technology

Cellular-modem company that publishes 4G/5G IoT chipsets, including GDM7243SL.

GalaxyCore

China·1 technology

CMOS-imaging company that publishes the GalaxyCell 2.0 pixel-process platform.