Companies & Organizations

AMEC

China·1 technology

Semiconductor equipment company that publishes plasma etch tools, including the Primo etch platform.

ASE Technology Holding

Taiwan·1 technology

Outsourced semiconductor assembly and test company that publishes advanced packaging platforms, including VIPack.

ASM

Netherlands·2 technologies

Wafer fabrication equipment company (ASM International) that publishes atomic layer deposition and related process-equipment technology for semiconductor manufacturing.

ASML

Netherlands·3 technologies

Lithography equipment company based in Veldhoven, the Netherlands, that publishes EUV and High-NA EUV system information used in advanced chip manufacturing.

ASMPT

Hong Kong·1 technology

Assembly-equipment company that publishes hybrid-bonding tools, including LITHOBOLT.

AT&S

Austria·1 technology

IC-substrate company that publishes high-density build-up substrates used to connect advanced processors to system boards.

AXT

United States·1 technology

Compound-semiconductor materials company that publishes VGF substrates for III-V devices.

Advanced Micro Devices

United States·2 technologies

Semiconductor company that publishes chiplet CPU architectures and 3D cache stacking, including Infinity Fabric and 3D V-Cache.

Advantest

Japan·1 technology

Automated test equipment company that publishes SoC testers, including the V93000 EXA Scale platform.

Aehr Test Systems

United States·1 technology

Semiconductor test company that publishes wafer-level burn-in and test systems, including FOX-XP.

Aheesa Digital Innovations

India·1 technology

Chennai semiconductor design company publishing Vihaan-I, a RISC-V networking system-on-chip. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.

Aixtron

Germany·1 technology

Deposition-equipment company that publishes Planetary Reactor MOCVD platforms.

Alchip Technologies

Taiwan·1 technology

High-performance ASIC company that publishes advanced-node design platforms, including a 2nm design methodology for HPC and AI ASICs.

Allegro MicroSystems

United States·1 technology

Magnetic-sensing company that publishes XtremeSense TMR technology.

Alpha and Omega Semiconductor

United States·1 technology

Power-semiconductor company that publishes MOSFET families, including AlphaSGT.

Amazon Web Services

United States·1 technology

Custom-silicon organization that publishes machine-learning accelerator architectures, including Trainium training silicon built around NeuronCore.

Ambiq

United States·1 technology

Ultra-low-power MCU company that publishes subthreshold processing technology, including SPOT.

Amkor Technology

United States·1 technology

Outsourced assembly and test company that publishes high-density fan-out packaging, including SWIFT.

Analog Devices

United States·1 technology

Analog and mixed-signal semiconductor company that publishes high-speed mixed-signal front-end platforms, including MxFE.

Apple

United States·1 technology

Fabless custom-silicon company that publishes system-on-chip architectures with on-package unified memory, including Apple Silicon.

Applied Materials

United States·2 technologies

Materials engineering and wafer-fab equipment company that publishes semiconductor process platforms used to deposit, shape, modify and analyze materials on wafers.

Arm

United Kingdom·1 technology

Semiconductor IP and architecture company that publishes processor, system and chiplet-related architecture specifications used in SoC and multi-die design.