Emerging Signal
Optical interconnect technologies designed to move increasing amounts of data between chips, systems and data-center infrastructure.
Silicon photonics and optical I/O use light to move data across shorter distances that have historically been electrical. The aim is higher bandwidth and better energy per bit between chiplets, packages, racks and data-center fabrics.
Electrical I/O is becoming a bottleneck as accelerator clusters grow. Optical links, photonic chiplets and silicon photonics platforms are being developed to keep scale-out AI and networking systems fed with data.
Follow co-packaged optics, optical I/O chiplets, and foundry or research silicon-photonics platforms as they move from demonstrations into system designs.
United States1 technology
Company that publishes optical I/O chiplet technology combining silicon photonics with CMOS for in-package and package-to-package connectivity.
View ProfileUnited States2 technologies
Semiconductor company that publishes Ethernet switch silicon and co-packaged optics platforms, including Tomahawk switch ASICs.
View ProfileUnited States3 technologies
Public semiconductor company that designs processors and related platforms and publishes foundry packaging, assembly and silicon photonics information for industry use.
View ProfileUnited States1 technology
Company that publishes photonic interconnect platform technology intended to scale high-bandwidth communication in advanced computing systems.
View ProfileBelgium1 technology
Nanoelectronics research organization based in Leuven, Belgium, that publishes silicon photonics platform and prototyping information, including the iSiPP family.
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Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
AI & HPCData CenterView Technology
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterView Technology
Intel silicon photonics platform combining photonic integrated circuits and on-chip lasers for optical connectivity products. Optical compute interconnect remains part of this platform, not a separate listing.
Data CenterTelecommunicationsView Technology
Lightmatter Passage is a photonic interconnect platform using integrated photonics and three-dimensional connectivity approaches to scale high-bandwidth communication across advanced AI and computing systems.
AI & HPCData CenterView Technology
imec silicon photonics platform family (iSiPP) for photonic integrated circuits. iSiPP200, iSiPP300 and related flavors are variants of this family, not separate listings.
Data CenterTelecommunicationsView TechnologyAyar Labs · Primary
TeraPHY Optical I/O Chiplet
Visit source (opens in a new tab)Intel
Intel Silicon Photonics
Visit source (opens in a new tab)imec
imec data and telecommunication applications
Visit source (opens in a new tab)Technology Signals are editorial summaries based on publicly available sources. Technical claims remain attributable to their original sources.
