Discover 169 technologies from leading innovators around the world.
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
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SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
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SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
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Allegro XtremeSense TMR is a tunneling-magnetoresistance magnetic-sensing platform, not a Hall-only catalog.
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Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
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Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
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Bosch MEMS sensor technology uses microelectromechanical structures to translate physical changes such as motion, pressure and environmental conditions into electrical information for compact sensing applications.
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