Discover 169 technologies from leading innovators around the world.
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunicationsIoTView Technology
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
Data CenterTelecommunicationsAerospace & DefenseView Technology
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
AutomotiveTelecommunicationsAerospace & DefenseView Technology
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Data CenterTelecommunicationsAerospace & DefenseView Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunicationsEnergy+1View Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData CenterTelecommunications+1View Technology
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
AutomotiveConsumer ElectronicsTelecommunications+1View Technology
Coherent’s III-V epitaxial wafer platform supplies compound-semiconductor epi wafers for photonic and RF devices, not industrial laser systems.
AutomotiveData CenterIndustrial+1View Technology
Credo SerDes is high-speed serializer/deserializer silicon and IP for data-center and AI interconnect, not a compute accelerator architecture.
AI & HPCData CenterTelecommunicationsView Technology
Lattice Nexus is a low-power FPGA platform architecture, not a data-center compute accelerator architecture.
AutomotiveIndustrialConsumer Electronics+1View Technology
Analog Devices MxFE is a mixed-signal front-end platform that integrates high-speed converters and digital processing for RF sampling systems.
IndustrialTelecommunicationsAerospace & DefenseView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1
Broadcom’s CPO platform heterogeneously integrates optical engines (TSMC COUPE) with Ethernet switch silicon. Tomahawk 6–Davisson is the third-generation CPO switch: 102.4 Tbps optically enabled capacity and a claimed reduction in optical-interconnect power versus pluggables.
AI & HPCData CenterTelecommunicationsView Technology
Tomahawk is Broadcom’s Ethernet switch-ASIC family for data-center and AI fabrics. Tomahawk 6 is the current generation: 102.4 Tbps in a single chip, 100G/200G SerDes, and an optional co-packaged optics variant.
AI & HPCData CenterTelecommunicationsView Technology
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
AutomotiveConsumer ElectronicsTelecommunications+1View Technology
Marvell’s coherent DSP family is the silicon that encodes and decodes coherent optical wavelengths for long-haul, metro and data-center interconnect. Official product pages describe coherent DSPs as a core Marvell optical connectivity franchise.
Data CenterTelecommunicationsView Technology
BlueField is NVIDIA’s data processing unit: Arm cores, high-speed Ethernet/InfiniBand and hardware accelerators for networking, storage and security offload, isolated from the host CPU.
AI & HPCData CenterTelecommunications
FastConnect 7900 is a 6 nm single-chip connectivity system integrating Wi-Fi 7, Bluetooth and UWB, with High Band Simultaneous Multi-Link and companion RF front-end modules.
Consumer ElectronicsTelecommunicationsIoTView Technology
Snapdragon X80 is Qualcomm's 5G Modem-RF system, combining the modem and RF front end, with 5G Advanced features and NB-NTN satellite support.
AutomotiveConsumer ElectronicsTelecommunicationsView Technology
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
IndustrialMedicalTelecommunications+1View Technology
Ayar Labs TeraPHY is an optical I/O chiplet that combines silicon photonics with CMOS technology to provide high-bandwidth, low-latency chip-to-chip and package-to-package connectivity for large-scale computing systems.
AI & HPCData CenterTelecommunicationsView Technology
Intel silicon photonics platform combining photonic integrated circuits and on-chip lasers for optical connectivity products. Optical compute interconnect remains part of this platform, not a separate listing.
Data CenterTelecommunicationsView Technology
