Discover 169 technologies from leading innovators around the world.
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
AutomotiveAI & HPCConsumer ElectronicsView Technology
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
AutomotiveIndustrialEnergyView Technology
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
AutomotiveData CenterIndustrial+1View Technology
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
AutomotiveAI & HPCConsumer ElectronicsView Technology
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
AutomotiveAI & HPCData Center+1View Technology
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
AutomotiveAI & HPCData Center+1View Technology
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Renesas R-Car is an automotive system-on-chip platform for ADAS, cockpit and vehicle compute, not a standalone data-center accelerator architecture.
AutomotiveAI & HPCView Technology
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
AutomotiveAI & HPCData Center+1View Technology
Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
AutomotiveIndustrialView Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrialConsumer Electronics+1View Technology
