Technology Area
Foundry process nodes and specialty wafer-process platforms.
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Technologies
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Companies
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Applications
Foundry / Process covers semiconductor process technologies whose primary identity is a published foundry node or process platform — including logic CMOS, FD-SOI, analog/RF BiCMOS and BCD, compound III-V, and 3D or embedded-memory process offerings. Listings describe the process platform rather than manufacturing equipment, starting wafers, packaging, licensed IP, or finished power devices.
Discover technologies, solutions and innovations in this area.
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer ElectronicsTelecommunications+1View Technology
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
AutomotiveAI & HPCData CenterView TechnologyKey application areas leveraging these technologies.
Technology area visuals are illustrative representations.
