Discover 169 technologies from leading innovators around the world.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPC+1View Technology
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
AI & HPCData Center+1View Technology
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
AI & HPCIndustrial+2View Technology
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
AI & HPCConsumer Electronics+1View Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPC+2View Technology
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
AutomotiveAI & HPC+1View Technology
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AutomotiveAI & HPC+1View Technology
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunications+1View Technology
SkyWater RH90 is a radiation-hardened 90 nm CMOS foundry process, not processor IP and not a packaged rad-hard MCU.
IndustrialAerospace & DefenseView Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer Electronics+2View Technology
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
Data CenterTelecommunications+1View Technology
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
AutomotiveAI & HPC+1View Technology
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
AutomotiveTelecommunications+1View Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData Center+1View Technology
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveConsumer ElectronicsView Technology
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
Data CenterTelecommunications+1View Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunications+2View Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData Center+2View Technology
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
IndustrialConsumer Electronics+2View Technology
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
AutomotiveConsumer Electronics+2View Technology
TrenchFET Gen V Power MOSFETs are Vishay's current published trench power-MOSFET generation.
AutomotiveIndustrial+2View Technology
ACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
AutomotiveAI & HPC+1View Technology
Allegro XtremeSense TMR is a tunneling-magnetoresistance magnetic-sensing platform, not a Hall-only catalog.
AutomotiveIndustrial+1View Technology
The Dragonfly G5 System is Onto Innovation's advanced-packaging inspection and metrology system.
AutomotiveAI & HPC+1View Technology
