Discover 169 technologies from leading innovators around the world.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
AI & HPCData CenterTelecommunicationsView Technology
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
Data CenterConsumer ElectronicsTelecommunications+1
Alchip’s 2nm Design Platform is an ASIC physical-design methodology for 2nm compute dies and chiplet packaging, not a foundry process node.
AI & HPCData CenterTelecommunicationsView Technology
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer ElectronicsTelecommunications+1
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData CenterConsumer Electronics+1
Filogic is MediaTek’s Wi-Fi 6/6E/7 connectivity platform for routers, gateways, access points and clients, with Multi-Link Operation, 320 MHz channels, 4096-QAM and dedicated NPUs on flagship access-point chips.
Consumer ElectronicsTelecommunicationsIoTView Technology
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
