Discover 169 technologies from leading innovators around the world.
Ultra-low-power connected-device system-on-chip that Sensesemi describes with wireless connectivity, a microcontroller, and an edge AI accelerator.
Consumer ElectronicsMedical+1View Technology
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AI & HPCData Center+1View Technology
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPC+1View Technology
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
AI & HPCConsumer Electronics+1View Technology
ESP32 is Espressif’s Wi-Fi and Bluetooth SoC platform, not a module SKU catalog and not processor IP.
IndustrialConsumer Electronics+1View Technology
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
AutomotiveAI & HPC+1View Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer Electronics+2View Technology
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
AutomotiveAI & HPC+1View Technology
Valens Stello VS3000 is high-speed connectivity silicon for AVoIP, not processor IP and not a finished camera.
IndustrialConsumer Electronics+1View Technology
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveIndustrial+1View Technology
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
AutomotiveIndustrial+2View Technology
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
AI & HPCData Center+1View Technology
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
AutomotiveIndustrial+1View Technology
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
AI & HPCData Center+1View Technology
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
Data CenterConsumer Electronics+2View Technology
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrial+1View Technology
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
AutomotiveAI & HPC+2View Technology
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveConsumer ElectronicsView Technology
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
AutomotiveData Center+2View Technology
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
AutomotiveAI & HPC+1View Technology
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
AutomotiveAI & HPC+2View Technology
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
IndustrialConsumer Electronics+2View Technology
