Discover 169 technologies from leading innovators around the world.
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
AutomotiveAI & HPCConsumer Electronics+1View Technology
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
AutomotiveConsumer ElectronicsTelecommunications+1View Technology
SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
AutomotiveIndustrialConsumer Electronics+1View Technology
TrenchFET Gen V Power MOSFETs are Vishay's current published trench power-MOSFET generation.
AutomotiveIndustrialConsumer Electronics+1View Technology
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
AutomotiveAI & HPCIndustrial+1
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
AutomotiveAI & HPCConsumer Electronics+1View Technology
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer ElectronicsTelecommunications+1
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
Lasertec ACTIS is an actinic EUV photomask inspection platform for high-volume EUV mask qualification.
AI & HPCData CenterConsumer ElectronicsView Technology
Texas Instruments analog BCD (LBC) is TI’s bipolar-CMOS-DMOS process identity for foundational analog and power silicon, described in official TI manufacturing communications.
AutomotiveIndustrialConsumer Electronics+1View Technology
Tokyo Electron CLEAN TRACK LITHIUS is a coater/developer track platform used with lithography tools in high-volume wafer fabrication.
AutomotiveAI & HPCData Center+1View Technology
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
AutomotiveAI & HPCConsumer ElectronicsView Technology
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
AI & HPCData CenterConsumer ElectronicsView Technology
Hua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.
AutomotiveIndustrialConsumer Electronics+1View Technology
CXMT LPDDR6 is ChangXin Memory Technologies’ current low-power DRAM generation, described in official newsroom coverage of mass production for mobile and AI-adjacent platforms.
AI & HPCData CenterConsumer ElectronicsView Technology
Lattice Nexus is a low-power FPGA platform architecture, not a data-center compute accelerator architecture.
AutomotiveIndustrialConsumer Electronics+1View Technology
NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
AutomotiveAI & HPCIndustrial+1View Technology
AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.
AI & HPCData CenterConsumer ElectronicsView Technology
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Nanya’s second-generation 10nm-class DRAM is the company’s current DRAM process generation, described in official investor communications.
AutomotiveData CenterConsumer ElectronicsView Technology
Soitec Smart Cut is the engineered-substrate process used to transfer a thin crystalline silicon film onto an insulator, producing SOI wafers.
AutomotiveIndustrialConsumer Electronics+1View Technology
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
AutomotiveAI & HPCData Center+1View Technology
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
AI & HPCData CenterConsumer Electronics+1View Technology
Nordic nRF54 is an ultra-low-power wireless IoT SoC platform, represented by the official nRF54H20 product family.
IndustrialConsumer ElectronicsMedical+1View Technology
