Discover 169 technologies from leading innovators around the world.
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
Elmos automotive motor-control ICs are mixed-signal BLDC driver chips, parked in Design & IP because Analog / Mixed Signal does not exist.
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
