Discover 169 technologies from leading innovators around the world.
KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.
AutomotiveData CenterConsumer ElectronicsView Technology
Microchip mSiC is a silicon carbide power semiconductor technology family spanning MOSFETs, Schottky barrier diodes, bare die and power modules. Those form factors are not separate listings.
AutomotiveData CenterIndustrial+2
Wolfspeed discrete silicon carbide MOSFET product line for power-conversion designs in industrial, energy and automotive systems.
AutomotiveIndustrialEnergyView Technology
KLA wafer defect inspection and review systems used to find, classify and monitor particles and pattern defects. Distinct from overlay and dimensional metrology.
AutomotiveData CenterConsumer ElectronicsView Technology
Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.
AutomotiveAI & HPCData CenterView Technology
Synopsys die-to-die IP solution for Universal Chiplet Interconnect Express, including controller, PHY and verification IP.
AutomotiveAI & HPCData CenterView Technology
Wolfspeed conductive silicon carbide substrates and SiC epitaxy materials offered for power-electronics device manufacturing.
AutomotiveIndustrialEnergyView Technology
