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54 results for Design & IP

Technologies

Design & IP

Cadence Integrity 3D-IC Platform

Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.

AutomotiveAI & HPCData CenterView Technology

Design & IP

Synopsys UCIe IP

Synopsys die-to-die IP solution for Universal Chiplet Interconnect Express, including controller, PHY and verification IP.

AutomotiveAI & HPCData CenterView Technology

Organizations

Advanced Micro Devices

United States2 technologies

Semiconductor company that publishes chiplet CPU architectures and 3D cache stacking, including Infinity Fabric and 3D V-Cache.

AI & HPCConsumer ElectronicsData Center+1View Profile

54 results for Design & IP

Technologies

Design & IP

Cadence Integrity 3D-IC Platform

Cadence design platform for planning, implementing and analyzing 2.5D and 3D multi-die / chiplet systems.

AutomotiveAI & HPCData CenterView Technology

Design & IP

Synopsys UCIe IP

Synopsys die-to-die IP solution for Universal Chiplet Interconnect Express, including controller, PHY and verification IP.

AutomotiveAI & HPCData CenterView Technology

Organizations

Advanced Micro Devices

United States2 technologies

Semiconductor company that publishes chiplet CPU architectures and 3D cache stacking, including Infinity Fabric and 3D V-Cache.

AI & HPCConsumer ElectronicsData Center+1View Profile

Alchip Technologies

Taiwan1 technology

High-performance ASIC company that publishes advanced-node design platforms, including a 2nm design methodology for HPC and AI ASICs.

AI & HPCData CenterTelecommunications+1

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Ambiq

United States1 technology

Ultra-low-power MCU company that publishes subthreshold processing technology, including SPOT.

AI & HPCConsumer ElectronicsIoT+1View Profile

Analog Devices

United States1 technology

Analog and mixed-signal semiconductor company that publishes high-speed mixed-signal front-end platforms, including MxFE.

Aerospace & DefenseIndustrialTelecommunications+1View Profile

Arm

United Kingdom1 technology

Semiconductor IP and architecture company that publishes processor, system and chiplet-related architecture specifications used in SoC and multi-die design.

AI & HPCAutomotiveData Center+1View Profile

Arteris

United States1 technology

Semiconductor IP company that publishes on-chip interconnect IP, including FlexNoC.

AI & HPCAutomotiveData Center+1View Profile

CEVA

United States1 technology

Processor-IP company that publishes DSP and neural-processing IP, including CEVA-NeuPro-Nano.

AI & HPCConsumer ElectronicsIoT+1View Profile

Cadence Design Systems

United States1 technology

Electronic design automation company that publishes multi-die design software, including the Integrity 3D-IC platform for planning, implementation and analysis of stacked-die systems.

AI & HPCAutomotiveData Center+1View Profile

Cirrus Logic

United States1 technology

Mixed-signal company that publishes Halo Core haptic-driver platforms.

AutomotiveConsumer ElectronicsDesign & IP+1View Profile

Elmos Semiconductor

Germany1 technology

Automotive mixed-signal semiconductor company that publishes motor-control ICs, including brushless DC motor drivers.

AutomotiveIndustrialDesign & IP+1View Profile