Application
Devices and process technologies used in consumer products.
76 technologies
Kokusai Batch ALD combines atomic-layer deposition with multi-wafer batch furnaces for 3D device films.
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
Qnity Emblem is a next-generation CMP pad platform for advanced-node planarization, not a polishing tool.
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
SCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
SUMCO Advanced Silicon Wafers are polished and specialty silicon starting substrates, including epitaxial, annealed and SOI wafers.
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
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