Emerging Signal
Backside power networks separate power delivery from signal routing to improve density, efficiency and scaling at advanced nodes.
Backside power delivery moves the power distribution network to the reverse side of a thinned wafer, leaving the front side available for signal routing. Backside metals connect to the transistors through fine vias, so power and signal no longer have to share the same routing layers.
At advanced nodes, dense signal routing and low-resistance power delivery compete for the same metal stack. Separating those networks is one approach under development for further logic scaling and for supplying power to dense devices.
Watch which process flows place power on the wafer backside, how those flows are combined with gate-all-around transistors and advanced packaging, and how design tools represent a backside power network.
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Backside power delivery
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Building blocks for a backside power delivery network
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