Discover 169 technologies from leading innovators around the world.
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
AI & HPCData Center+2View Technology
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
AI & HPCData Center+1View Technology
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
AI & HPCData CenterView Technology
Intel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.
AI & HPCData Center+1View Technology
