Discover 169 technologies from leading innovators around the world.
NB-IoT system-on-chip that WiSig Networks describes as a 3GPP-compliant device with satellite non-terrestrial-network support and edge AI.
TelecommunicationsIoTView Technology
Saankhya Labs' Pruthvi-3 is a software-defined radio chipset series spanning baseband, mobile-receiver and modulator devices.
TelecommunicationsIoTView Technology
Ultra-low-power connected-device system-on-chip that Sensesemi describes with wireless connectivity, a microcontroller, and an edge AI accelerator.
Consumer ElectronicsMedical+1View Technology
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrial+2View Technology
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
AI & HPCIndustrial+2View Technology
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
AI & HPCConsumer Electronics+1View Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPC+2View Technology
ESP32 is Espressif’s Wi-Fi and Bluetooth SoC platform, not a module SKU catalog and not processor IP.
IndustrialConsumer Electronics+1View Technology
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunications+1View Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer Electronics+2View Technology
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
AutomotiveIndustrial+2View Technology
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
Realtek Ethernet Total Solutions is a wired-connectivity PHY and controller platform, currently evidenced by live 2.5GbE product pages.
Data CenterConsumer Electronics+2View Technology
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunications+2View Technology
SiTime MEMS First and EpiSeal are resonator fabrication processes that encapsulate silicon MEMS in epitaxial vacuum cavities.
AutomotiveData Center+2View Technology
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
IndustrialConsumer Electronics+2View Technology
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
AutomotiveAI & HPC+2View Technology
Skyworks Sky5 is a 5G RF front-end system platform, not a foundry process and not a baseband SoC.
AutomotiveConsumer Electronics+2View Technology
SmartSens SmartClarity is a named CMOS image-sensor platform still published on official product series pages in 2026.
AutomotiveIndustrial+2View Technology
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
AutomotiveAI & HPC+2View Technology
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer Electronics+2View Technology
Hua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.
AutomotiveIndustrial+2View Technology
Nordic nRF54 is an ultra-low-power wireless IoT SoC platform, represented by the official nRF54H20 product family.
IndustrialConsumer Electronics+2View Technology
