Discover 169 technologies from leading innovators around the world.
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
AutomotiveIndustrial+1View Technology
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
AutomotiveData Center+2View Technology
Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
AutomotiveIndustrialView Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrial+2View Technology
