Discover 169 technologies from leading innovators around the world.
Sony’s stacked SPAD depth sensors use single-photon avalanche diodes and direct time-of-flight, with Cu-Cu pixel-to-logic connections, for long-range LiDAR and industrial ranging.
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Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
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