Explore Semiconductor Technologies

Discover 169 technologies from leading innovators around the world.

All (169)Advanced Packaging Manufacturing Equipment Materials & Substrates Foundry / Process

Datacon 8800 CHAMEO Hybrid Bonding

Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.

AI & HPCData CenterConsumer ElectronicsView Technology

Manufacturing Equipment

ASM Atomic Layer Deposition (ALD)

ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.

AI & HPCData CenterConsumer ElectronicsView Technology