Discover 169 technologies from leading innovators around the world.
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrial+2View Technology
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPC+1View Technology
Elmos automotive motor-control ICs are mixed-signal BLDC driver chips, parked in Design & IP because Analog / Mixed Signal does not exist.
AutomotiveIndustrialView Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPC+2View Technology
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
AutomotiveAI & HPC+1View Technology
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AutomotiveAI & HPC+1View Technology
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
AutomotiveAI & HPC+1View Technology
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
AutomotiveAI & HPC+1View Technology
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
AutomotiveIndustrial+1View Technology
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
AutomotiveIndustrial+2View Technology
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
AutomotiveAI & HPC+1View Technology
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
AutomotiveAI & HPC+1View Technology
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveIndustrial+1View Technology
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
AutomotiveIndustrial+2View Technology
FormFactor composite-metal MEMS is a wafer-probe-card technology, not a MEMS sensor product.
AutomotiveAI & HPC+1View Technology
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
AutomotiveIndustrial+1View Technology
Camtek Eagle is a wafer inspection and metrology equipment platform for BEOL, advanced packaging and related flows.
AutomotiveAI & HPC+1View Technology
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
AutomotiveData Center+2View Technology
Qorvo Elite360 is a GaN and GaAs foundry-services platform, parked in Design & IP because Foundry / Process does not yet exist.
AutomotiveTelecommunications+1View Technology
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrial+1View Technology
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
AutomotiveAI & HPC+2View Technology
Cirrus Halo Core is the DSP inside Cirrus haptic drivers, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveConsumer ElectronicsView Technology
