Discover 169 technologies from leading innovators around the world.
Ultra-low-power connected-device system-on-chip that Sensesemi describes with wireless connectivity, a microcontroller, and an edge AI accelerator.
Consumer ElectronicsMedical+1View Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer Electronics+2View Technology
Valens Stello VS3000 is high-speed connectivity silicon for AVoIP, not processor IP and not a finished camera.
IndustrialConsumer Electronics+1View Technology
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
IndustrialConsumer Electronics+2View Technology
Nordic nRF54 is an ultra-low-power wireless IoT SoC platform, represented by the official nRF54H20 product family.
IndustrialConsumer Electronics+2View Technology
Sony’s stacked CMOS image sensor separates the pixel die from the logic die and joins them with Cu-Cu hybrid bonding, replacing TSVs. Official technology pages describe Cu-Cu as enabling denser, smaller, higher-function sensors.
AutomotiveIndustrial+2View Technology
Microchip PolarFire SoC combines a coherent multi-core RISC-V CPU subsystem with PolarFire FPGA fabric on one device for Linux and real-time embedded systems.
IndustrialMedical+2View Technology
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
IndustrialMedical+2View Technology
